Amkor Technologies, Inc.

Amkor provides leading-edge package solutions such as Package on Package (PoP), Stacked Packaging, Flip Chip, MicroLeadFrame®, System-in-Package, MEMS, and Wafer Level Packaging (WLP), for latest generation applications. Amkor offers the industry's broadest array of package formats and sizes, from traditional, "off-the-shelf" leadframe configurations to leading-edge chip scale, flip chip and system-in-package solutions incorporating highly customized designs. This allows Amkor to be a single source for many of our customers' total IC packaging requirements. We also provide a complete range of test engineering services for RF, mixed signal, logic and memory devices, from test program development to full product characterization. Amkor is a major provider of RF test services and is the world leader in Strip Test, an innovative, highly parallel test solution that offers customers low cost, faster index time and improved test yields.

Source: http://www.amkor.com/go/about-us

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